Journal article
Suyash Kushwaha, D. Das, Sourajeet Roy, Rohit Sharma
Electrical Design of Advanced Packaging and Systems Symposium, 2024
Electrical Design of Advanced Packaging and Systems Symposium, 2024
Semantic Scholar
DOI
Cite
Cite
APA
Click to copy
Kushwaha, S., Das, D., Roy, S., & Sharma, R. (2024). Signal Integrity Analysis of Ultra-scaled Copper-Graphene Heterogeneous Interconnect Structure. Electrical Design of Advanced Packaging and Systems Symposium.
Chicago/Turabian
Click to copy
Kushwaha, Suyash, D. Das, Sourajeet Roy, and Rohit Sharma. “Signal Integrity Analysis of Ultra-Scaled Copper-Graphene Heterogeneous Interconnect Structure.” Electrical Design of Advanced Packaging and Systems Symposium (2024).
MLA
Click to copy
Kushwaha, Suyash, et al. “Signal Integrity Analysis of Ultra-Scaled Copper-Graphene Heterogeneous Interconnect Structure.” Electrical Design of Advanced Packaging and Systems Symposium, 2024.
BibTeX Click to copy
@article{suyash2024a,
title = {Signal Integrity Analysis of Ultra-scaled Copper-Graphene Heterogeneous Interconnect Structure},
year = {2024},
journal = {Electrical Design of Advanced Packaging and Systems Symposium},
author = {Kushwaha, Suyash and Das, D. and Roy, Sourajeet and Sharma, Rohit}
}
Abstract
In this paper, a novel copper graphene heterogeneous interconnect structure is proposed that retains the ease of fabrication while offering significantly improved performance. Signal integrity analysis is performed considering insertion loss and eye diagram. The electrical performance of the proposed hetero interconnects is found to be better than the conventional copper interconnects, making these nano-interconnects suitable for back end of line (BEOL) applications.