Journal article
Electrical Design of Advanced Packaging and Systems Symposium, 2019
APA
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Guglani, S., Kumar, A., Kumar, R., Kaushik, B. K., Sharma, R., Achar, R., & Roy, S. (2019). Temperature-Aware Closed-Form Matrix Rational Approximation Model for Crosstalk Analysis of Multi-Walled Carbon Nanotube Interconnects. Electrical Design of Advanced Packaging and Systems Symposium.
Chicago/Turabian
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Guglani, Surila, Amit Kumar, Rahul Kumar, Brajesh Kumar Kaushik, Rohit Sharma, R. Achar, and Sourajeet Roy. “Temperature-Aware Closed-Form Matrix Rational Approximation Model for Crosstalk Analysis of Multi-Walled Carbon Nanotube Interconnects.” Electrical Design of Advanced Packaging and Systems Symposium (2019).
MLA
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Guglani, Surila, et al. “Temperature-Aware Closed-Form Matrix Rational Approximation Model for Crosstalk Analysis of Multi-Walled Carbon Nanotube Interconnects.” Electrical Design of Advanced Packaging and Systems Symposium, 2019.
BibTeX Click to copy
@article{surila2019a,
title = {Temperature-Aware Closed-Form Matrix Rational Approximation Model for Crosstalk Analysis of Multi-Walled Carbon Nanotube Interconnects},
year = {2019},
journal = {Electrical Design of Advanced Packaging and Systems Symposium},
author = {Guglani, Surila and Kumar, Amit and Kumar, Rahul and Kaushik, Brajesh Kumar and Sharma, Rohit and Achar, R. and Roy, Sourajeet}
}
This paper presents a temperature-aware matrix rational approximation (MRA) technique for the predictive modeling of multiwall carbon nanotube (MWCNT) on-chip interconnect networks. The key feature of the proposed technique is its capacity to account for the effects of temperature variations on the crosstalk in MWCNT networks without having to reconstruct the model.