Journal article
2015 IEEE Symposium on Electromagnetic Compatibility and Signal Integrity, 2015
APA
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Ahadi, M., Vempa, M., & Roy, S. (2015). Efficient multidimensional statistical modeling of high speed interconnects in SPICE via stochastic collocation using stroud cubature. 2015 IEEE Symposium on Electromagnetic Compatibility and Signal Integrity.
Chicago/Turabian
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Ahadi, Majid, Mounica Vempa, and Sourajeet Roy. “Efficient Multidimensional Statistical Modeling of High Speed Interconnects in SPICE via Stochastic Collocation Using Stroud Cubature.” 2015 IEEE Symposium on Electromagnetic Compatibility and Signal Integrity (2015).
MLA
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Ahadi, Majid, et al. “Efficient Multidimensional Statistical Modeling of High Speed Interconnects in SPICE via Stochastic Collocation Using Stroud Cubature.” 2015 IEEE Symposium on Electromagnetic Compatibility and Signal Integrity, 2015.
BibTeX Click to copy
@article{majid2015a,
title = {Efficient multidimensional statistical modeling of high speed interconnects in SPICE via stochastic collocation using stroud cubature},
year = {2015},
journal = {2015 IEEE Symposium on Electromagnetic Compatibility and Signal Integrity},
author = {Ahadi, Majid and Vempa, Mounica and Roy, Sourajeet}
}