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Indian Institute of Technology Roorkee

Parallel Transient Simulation of Package/Board Power Distribution Networks Based on a 2-D Overlapping Partitioning Methodology


Journal article


Sourajeet Roy, A. Dounavis
IEEE Transactions on Components, Packaging, and Manufacturing Technology, 2013

Semantic Scholar DOI
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APA   Click to copy
Roy, S., & Dounavis, A. (2013). Parallel Transient Simulation of Package/Board Power Distribution Networks Based on a 2-D Overlapping Partitioning Methodology. IEEE Transactions on Components, Packaging, and Manufacturing Technology.


Chicago/Turabian   Click to copy
Roy, Sourajeet, and A. Dounavis. “Parallel Transient Simulation of Package/Board Power Distribution Networks Based on a 2-D Overlapping Partitioning Methodology.” IEEE Transactions on Components, Packaging, and Manufacturing Technology (2013).


MLA   Click to copy
Roy, Sourajeet, and A. Dounavis. “Parallel Transient Simulation of Package/Board Power Distribution Networks Based on a 2-D Overlapping Partitioning Methodology.” IEEE Transactions on Components, Packaging, and Manufacturing Technology, 2013.


BibTeX   Click to copy

@article{sourajeet2013a,
  title = {Parallel Transient Simulation of Package/Board Power Distribution Networks Based on a 2-D Overlapping Partitioning Methodology},
  year = {2013},
  journal = {IEEE Transactions on Components, Packaging, and Manufacturing Technology},
  author = {Roy, Sourajeet and Dounavis, A.}
}