Journal article
IEEE Transactions on Components, Packaging, and Manufacturing Technology, 2013
APA
Click to copy
Roy, S., & Dounavis, A. (2013). Parallel Transient Simulation of Package/Board Power Distribution Networks Based on a 2-D Overlapping Partitioning Methodology. IEEE Transactions on Components, Packaging, and Manufacturing Technology.
Chicago/Turabian
Click to copy
Roy, Sourajeet, and A. Dounavis. “Parallel Transient Simulation of Package/Board Power Distribution Networks Based on a 2-D Overlapping Partitioning Methodology.” IEEE Transactions on Components, Packaging, and Manufacturing Technology (2013).
MLA
Click to copy
Roy, Sourajeet, and A. Dounavis. “Parallel Transient Simulation of Package/Board Power Distribution Networks Based on a 2-D Overlapping Partitioning Methodology.” IEEE Transactions on Components, Packaging, and Manufacturing Technology, 2013.
BibTeX Click to copy
@article{sourajeet2013a,
title = {Parallel Transient Simulation of Package/Board Power Distribution Networks Based on a 2-D Overlapping Partitioning Methodology},
year = {2013},
journal = {IEEE Transactions on Components, Packaging, and Manufacturing Technology},
author = {Roy, Sourajeet and Dounavis, A.}
}